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PCB Fabrication and Assembly Services for Custom Electronics

Zenbot China reviews PCB fabrication, component sourcing, SMT and through-hole assembly, inspection and testing needs for custom electronics. Preparing files for a quote? See our PCB assembly file checklist.

Capabilities

Process capability overview

ProcessCapabilityMaximum sizeTypical lead time
PCB Fabrication1–32 layers500 × 500 mm panel48 hours–5 days
SMT AssemblyDown to 0201 components400 × 300 mm panel3–5 days
THT AssemblyManual / wave solderingProject-dependentTypically +1–2 days
Functional TestingCustom test fixturesProject-dependentProject-dependent

Indicative capabilities only. Layer count, component size, panel dimensions and lead time are confirmed after engineering review.

Materials

Available materials

M01

FR-4 Standard

Standard rigid PCB substrate for general applications.

M02

FR-4 High-Tg

Higher thermal resistance for demanding operating environments.

M03

Aluminum (MCPCB)

Metal-core boards for LED and power electronics applications.

M04

RF Laminates

High-frequency laminate options for RF and microwave designs.

M05

Flex & Rigid-Flex

Polyimide-based constructions for flexible and folding assemblies.

M06

ENIG / HASL Finish

Common surface finish options supporting solderability and shelf life.

Material grade, laminate brand, stack-up and surface finish availability are confirmed during engineering review.

Surface finishes

Finishing options

  • ENIG (gold)
  • HASL / Lead-free HASL
  • OSP
  • Immersion silver
  • Conformal coating
  • Protective coating

Finish chemistry, thickness and coating requirements are confirmed during engineering review.

Design for manufacturing
01

Pad & footprint design

Confirm land patterns, polarity and solderability requirements against the approved component data.

02

Panelization requirements

Define V-score or tab-routing, tooling features and rail requirements during DFM review.

03

Silkscreen clearance

Keep reference text and markings clear of pads, exposed copper and critical component areas.

04

Component placement

Provide practical spacing for automated assembly, inspection, rework and test access.

Applications

Industries we serve

  • IoT & Smart Devices
  • Consumer Electronics
  • Industrial Controls
  • Wearables
  • Telecommunications
  • Robotics

Project suitability, regulatory needs and verification scope are confirmed during engineering review.

Sensor control board

4-layer FR-4, full turnkey with BOM sourcing

Wearable fitness tracker

Rigid-flex PCB, ENIG finish, SMT assembly.

Industrial power module

Aluminum MCPCB, THT assembly, burn-in tested

FAQ

Common questions

Can you source components for me?

Yes. Share your BOM and approved sourcing requirements; alternatives for constrained parts are proposed for your review before use.

What testing do you offer?

Inspection plans may include AOI, X-ray for applicable packages, and functional testing when requirements and fixtures are agreed.

Do you support small prototype runs?

Prototype and production quantities can be reviewed. Minimum order quantity and production route are confirmed for each project.

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